Supersaturated solid-solution interfaces of Cu core/Ag shell structures with enhanced thermal stability and oxidation resistance

The supersaturated solid-solution interfaces between Cu core and Ag shell structures improve their bonding strength greatly prevent the outward diffusion of atoms slow down growth oxides. printed CuAg x electrodes maintain high conductivity for a long time even at 220 °C, which is far better than conventional core/Ag Cu/Ag mixed that rapidly oxidize below 150 °C. These findings not only promote broad applications but also pave potential way fabrication various stable core/shell structure materials. • Supersaturated cores shells are generated. enable to Diffusion out from Cu-rich phases requires °C least 64 h. Oxidation process completely investigated.